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2025-06-17

What are the processes for semiconductor packaging materials?

Semiconductor packaging processes mainly include wire bonding, flip chip, wafer-level packaging, system-in-package (SiP), 3D packaging, ball grid array (BGA), quad flat no-lead (QFN), etc.

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2025-06-17

What materials are used for semiconductor heat sinks?

Such as copper and aluminum. Although traditional metallic materials (such as copper and aluminum) have high thermal conductivity, they are heavy, have limited mechanical strength, and are prone to electromagnetic interference (EMI) problems in high-frequency applications.

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2025-06-17

Working principle of high-density VC vapor chamber

The high-density vapor chamber (VC) operates on the principle of phase change, using the evaporation and condensation cycle of the internal liquid to achieve rapid heat conduction.

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What is the function of wafer-level packaging substrates?

Wafer-level packaging carriers play a vital role in semiconductor manufacturing.

2025/06

What is a graphics card module?

A graphics card module is a modular solution that integrates multiple graphics cards using specific technologies (such as NVLink). It is mainly used in high-performance computing and artificial intelligence fields.

2025/06

Advantages and disadvantages of laser heat dissipation modules

The laser cooling module uses water circulation to dissipate heat. Leveraging the high specific heat capacity of water, it can quickly absorb and disperse the heat generated by the laser, ensuring stable operation of the laser in high-temperature environments.

2025/06

The function of intelligent heat dissipation module

The main function of an intelligent heat dissipation module is to optimize heat dissipation and ensure stable operation of the device under high load.

2025/06

Application fields of semiconductors

The applications of semiconductors span dozens of industries, including communications, consumer electronics, automotive electronics, optoelectronics, and medical devices.

2025/06

Main types of semiconductor packaging materials

Semiconductor packaging materials mainly include plastic packaging materials, ceramic packaging materials, and metal packaging materials.

2025/06

Congratulations on the launch of Hunan Zhihao Hang Precision Technology Co., Ltd.'s website!

2025/06

86-136 0744 2601

Address: No. 289, Aviation Road, Wangcheng Economic Development Zone, Changsha City
Email:wangxiaoxia@zhihaohang.com

Contact Person: Liu Xin
Tel:86-19974841533
Email:liuxin@zhihaohang.com
Contact Person: Liu Wei
Tel:86-18229707922
Email:liuwei@zhihaohang.com

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