Packaging-level heat dissipation solution service provider

Packaging-level heat dissipation solution service provider

Semiconductor

Packaging materials
Process Fixture
Device

Smart Terminal

Standard products
Machined parts

Heatsink

Server module
Laser heat dissipation module
Graphics card module

Company Strength

Hunan Zhihao Hang Precision Technology Co., Ltd.

As a high-tech and specialized and new enterprise in Hunan Province, Zhihao Hang Precision Technology has been deeply engaged in the innovation and research and development in the field of thermal management. With its leading R&D capabilities in thermal management technology and a full-process closed-loop industrial chain, it provides professional thermal management solutions for the global semiconductor packaging and high-end manufacturing industries. The company's headquarters is located in Changsha National High-tech Industrial Development Zone.

60 million yuan

Total Investment in Production Base

50000 m²+

Factory Area

40 +

Various Patents

2 KK

Monthly Production Capacity

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SINCE

2021

News

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What are the processes for semiconductor packaging materials?

What are the processes for semiconductor packaging materials?

2025-06-17

Semiconductor packaging processes mainly include wire bonding, flip chip, wafer-level packaging, system-in-package (SiP), 3D packaging, ball grid array (BGA), quad flat no-lead (QFN), etc.
What materials are used for semiconductor heat sinks?

What materials are used for semiconductor heat sinks?

2025-06-17

Such as copper and aluminum. Although traditional metallic materials (such as copper and aluminum) have high thermal conductivity, they are heavy, have limited mechanical strength, and are prone to electromagnetic interference (EMI) problems in high-frequency applications.
Working principle of high-density VC vapor chamber

Working principle of high-density VC vapor chamber

2025-06-17

The high-density vapor chamber (VC) operates on the principle of phase change, using the evaporation and condensation cycle of the internal liquid to achieve rapid heat conduction.

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