Double-layer hot-rolled material chip heat sink cover and packaged chip

Double-layer hot-rolled material chip heat sink cover and packaged chip

Stress relief support structure for chip installation

Stress relief support structure for chip installation

A chip warp bonding support structure

A chip warp bonding support structure

Integrated heat dissipation support cover and chip support heat dissipation structure

Integrated heat dissipation support cover and chip support heat dissipation structure

A self-heat-dissipating support and a chip packaging structure having a self-heat-dissipating support

A self-heat-dissipating support and a chip packaging structure having a self-heat-dissipating support

An automatic feeding device for copper clad laminates

An automatic feeding device for copper clad laminates

Night cold heat dissipation components and chip packaging structure

Night cold heat dissipation components and chip packaging structure

A chip heat sink cover plate

A chip heat sink cover plate

IGBT module cleaning device

IGBT module cleaning device

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