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2025
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What are the processes for semiconductor packaging materials?
Author:
Semiconductor packaging processes mainly include wire bonding, flip-chip, wafer-level packaging, system-in-package (SiP), 3D packaging, ball grid array (BGA), quad flat no-lead (QFN), etc., covering a comprehensive technical system from traditional interconnection technologies to advanced integration solutions.
Traditional Interconnection Technology
Wire Bonding
Uses metal wires to connect chip pads to package pins, including gold wire ball bonding and aluminum wire ultrasonic bonding.
Advantages: Low cost, mature technology; Disadvantages: Low I/O density.
Flip-Chip
The chip solder balls are directly soldered to the substrate pads to achieve short paths and high I/O density interconnection, widely used in high-performance chips.
Advanced Packaging Technology
Wafer-Level Packaging (WLP)
Packaging is completed at the wafer stage, and chips are directly obtained after cutting. It is divided into fan-in (Fan-In WLCSP) and fan-out (Fan-Out WLP).
Fan-out packaging expands pins through redistribution layers and is used in high-end chips such as Apple's A-series processors.
System-in-Package (SiP)
Integrates multiple chips and passive components to form a complete system, supporting heterogeneous chip combinations, commonly used in wearable devices and 5G modules.
High-Density Packaging Solutions
Ball Grid Array (BGA)
Solder balls arranged in a grid on the bottom achieve high-density connection, reducing signal loss, suitable for high-performance devices such as CPUs and GPUs.
Quad Flat No-Lead (QFN)
Leadless design combined with bottom pads and surrounding heat sinks, suitable for miniaturized devices and high heat dissipation requirements.
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Latest News
2025-06-17
What are the processes for semiconductor packaging materials?
Semiconductor packaging processes mainly include wire bonding, flip chip, wafer-level packaging, system-in-package (SiP), 3D packaging, ball grid array (BGA), quad flat no-lead (QFN), etc.
2025-06-17
What materials are used for semiconductor heat sinks?
Such as copper and aluminum. Although traditional metallic materials (such as copper and aluminum) have high thermal conductivity, they are heavy, have limited mechanical strength, and are prone to electromagnetic interference (EMI) problems in high-frequency applications.
2025-06-17
Working principle of high-density VC vapor chamber
The high-density vapor chamber (VC) operates on the principle of phase change, using the evaporation and condensation cycle of the internal liquid to achieve rapid heat conduction.
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