Strategic layout


2026

Mass production of new metal heat dissipation materials Overall R&D solution for chip-level heat dissipation (air cooling, liquid cooling)
2026

2025

MC LID Process Research and Development · Novel Metal Heat Dissipation Materials · Packaging-Level Heat Dissipation Overall Solution Research and Development (Air Cooling)
2025

2024

VC LID mass production MC LID process development Development of new metal heat dissipation materials
2024

2023

Mass production of ordinary heat dissipation covers • R&D of new heat dissipation material processes • R&D of VC LID processes
2023