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2025
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06
What materials are used for semiconductor heat sinks?
Author:
The materials for semiconductor heat sinks mainly include the following categories:
Metal materials: such as copper and aluminum. Although traditional metal materials (such as copper and aluminum) have high thermal conductivity, they are heavy, have limited mechanical strength, and are prone to electromagnetic interference (EMI) problems in high-frequency applications.
High thermal conductivity ceramic materials: such as aluminum nitride (AlN) and silicon nitride (Si₃N₄). These materials not only have high thermal conductivity but also excellent mechanical strength and electrical insulation, so they are widely used in power electronics packaging.
Carbon-based materials: including graphite, graphene, carbon nanotubes, and carbon fibers. The high thermal conductivity of carbon materials makes it a popular direction for future heat dissipation materials. For example, the theoretical thermal conductivity of graphene is as high as 5000 W/(m·K), almost ten times that of copper, but it is currently mainly used for thermal conductive fillers, coatings, and composite materials.
Liquid metal: such as gallium-based alloys. Liquid metals, due to their ultra-high thermal conductivity (>30 W/(m·K)) and extremely low thermal interface resistance, have become a breakthrough solution for high-end heat dissipation applications.
Indium sheet: As a highly thermally conductive metal material, indium sheet has a thermal conductivity of up to 82W/m·k, which can more effectively transfer heat, reduce the operating temperature of semiconductor devices, and improve system stability and reliability.
Aluminum nitride ceramic substrate: Aluminum nitride ceramic substrates have excellent thermal conductivity and mechanical strength and are suitable for high-power applications such as IGBT packaging.
Thermal grease: This is a paste-like thermal interface material with excellent wettability and low contact thermal resistance, widely used in the heat dissipation of IGBT modules.
Phase-change thermal conductive material: Made using polymer technology, it can soften at the operating temperature of the device, fill gaps, and has excellent heat dissipation performance and stability.
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