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2025
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06
What is the function of wafer-level packaging substrates?
Author:
Wafer-level packaging carriers play a crucial role in semiconductor manufacturing. Their main functions include protecting the wafer's physical safety and chemical purity during the packaging process, ensuring the smooth progress of the packaging process.
The Role of Wafer-Level Packaging Carriers
Protective Function: Wafer carriers effectively prevent physical damage to wafers during handling, storage, and processing, such as scratches and breakage, ensuring the integrity of the wafer.
Purification Environment: Through enclosed design and the use of specific materials, wafer carriers minimize the wafer's contact with air and contaminants, maintaining a high-cleanliness environment.
Temperature and Humidity Control: Some high-end carriers also have temperature and humidity control functions to ensure the stability of the wafer under specific environmental conditions. This is crucial for some processes sensitive to the environment.
Automation Compatibility: Modern wafer carrier designs consider compatibility with automated equipment, facilitating fast and accurate operation on highly automated semiconductor production lines.
Material Selection and Process Adaptability
The choice of materials for wafer carriers depends on their specific needs in different processes. Common materials include PFA (perfluoroalkoxy resin), PP (polypropylene), PEEK (polyetheretherketone), PC (polycarbonate), PEI (polyetherimide), PES (polyethersulfone), PBT (polybutylene terephthalate), and COP (cycloolefin polymer), etc. These materials are widely used in general transfer processes, each with its own characteristics, such as good heat resistance, mechanical strength, or transparency. For special needs, such as high-temperature processing or special chemical environments, more professional materials may be used to meet the requirements under extreme conditions.
Overview of Wafer-Level Packaging Technology
Wafer-level packaging technology directly performs packaging and testing on the entire wafer, and then cuts it into individual components. This method greatly saves circuit board space, making the design of electronic devices more compact and meeting the current development trend of thin and light electronic products. In addition, wafer-level packaging significantly improves the speed and stability of data transmission by shortening the length of the connecting lines, especially suitable for applications with high-frequency and high-performance requirements.
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