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Category:

尺寸:

80*60mm

材质:

C1100

表面处理:

Electroplating nickel

Details

Features:

Overall reduction in the cost of heat dissipation components

Heat dissipation components are closer to the chip, resulting in better heat dissipation

Compared to the RING structure, it can better protect the chip and has higher reliability

Applications: AI chips, cloud servers, autonomous driving, military equipment

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VC LID

Overall, it can reduce the cost of heat dissipation components

Other Products

VC LID

Overall, it can reduce the cost of heat dissipation components

VC LID

Overall, it can reduce the cost of heat dissipation components

VC LID

Overall, it can reduce the cost of heat dissipation components

Ring

Features: High precision, high planarity, and globally advanced electroplating technology

Ring

Features: High precision, high planarity, and globally advanced electroplating technology

Ring

Features: High precision, high planarity, and globally advanced electroplating technology

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