Category:
尺寸:
30*30mm
材质:
C1100
表面处理:
Electroplating nickel
Details
Features:
Overall reduction in the cost of heat dissipation components
Heat dissipation components are closer to the chip, resulting in better heat dissipation
Compared to the RING structure, it can better protect the chip and has higher reliability
Applications: AI chips, cloud servers, autonomous driving, military equipment
Other Products
Overall, it can reduce the cost of heat dissipation components
Overall, it can reduce the cost of heat dissipation components
Overall, it can reduce the cost of heat dissipation components
Features: High precision, high planarity, and globally advanced electroplating technology
Features: High precision, high planarity, and globally advanced electroplating technology
Features: High precision, high planarity, and globally advanced electroplating technology
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